Multipurposeparquet adhesive Resybrid CP 130 - creamy
Single-component, solvent-free hybrid parquet adhesive, non-toxic to humans
Supplied in 3x7kg cartons to avoid waste and facilitate storage
Resybrid CP 130 is a single-component hybrid elastomer-based adhesive designed for full-bed bonding of all formats of engineered flooring and solid wood flooring up to 130 mm wide and 14 mm thick. Its solvent- and isocyanate-free formulation ensures safe, durable application that is respectful of the health of those applying it.
Thanks to its strong adhesion and rapid polymerisation, Resybrid CP 130 ensures reliable and durable bonding on a wide variety of substrates, including those subject to significant thermal or mechanical stresses.
Performance and technical advantages
Resybrid CP 130 has elastic properties that effectively compensate for the natural movement of wood and irregularities in the substrate. It helps to improve the acoustic comfort of buildings by reducing vibrations and attenuating impact noise.
This adhesive is ideal for use on underfloor heating, electric radiant floors and reversible floors, with full-surface bonding required. Its low volatile organic compound content contributes to excellent indoor air quality and low environmental impact.
Areas of application and compatible substrates
Resybrid CP 130 is intended for professional use in the installation of new or renovated parquet flooring. It can be applied with a notched trowel to flat substrates of solid wood parquet up to 130 mm wide, as well as engineered parquet of all sizes.
It offers excellent adhesion without primer on most common substrates such as wood, CTBH, CTBX, cement-based screeds, anhydrite screeds, old tiles and old parquet flooring on joists. It is also suitable for exotic woods, oily woods and heat-treated woods.
For large solid wood flooring, long or thick boards, special attention must be paid to installation. In order to ensure the durability of the bond, it is recommended to increase the amount of adhesive applied and to carry out a pre-loading phase of 25 to 30 kg per 4 m² until complete polymerisation.
Preparation of substrates
The substrate must comply with the requirements of DTU 51.2 (NFP 63-202). It must be dry, sound, cohesive, clean and homogeneous, free of dust, laitance, grease, bitumen, silicone, old adhesives, curing compounds, waxes or maintenance products.
The flatness of the substrate must not exceed 1 mm under a 20 cm straight edge and 5 mm under a 2 m straight edge. The moisture content of the substrate must be checked, preferably using a carbide bomb. It must not exceed 3% for substrates based on hydraulic binders and 0.5% for calcium sulphate-based screeds.
Paving or flooring must not expose the parquet to rising damp or moisture infiltration. In the case of concrete paving on crawl spaces, embankments or slabs, it is essential to install a damp-proof barrier.
Special case of underfloor heating
For installation on underfloor heating, the natural drying of the substrate must be supplemented by heating the installation for at least three weeks before laying the parquet. The heating must be turned off 48 hours before applying the levelling compound and laying the parquet, then gradually turned back on at least one week after installation.
The maximum permissible moisture content of the substrate is 2% for floors based on hydraulic binders and 0.5% for calcium sulphate-based screeds. The substrates can be prepared with EP21 primer, in accordance with its technical data sheet.
Application and working conditions
The temperature of the premises, the substrate and the adhesive must be at least +15°C during application and throughout the polymerisation process. When laying on underfloor heating, the temperature of the substrate must be around +20°C. The ambient humidity must be between 45% and 65%.
The adhesive is applied directly to the substrate using a B12 notched trowel, at a rate of 1,000 to 1,400 g/m². It is recommended to glue areas approximately 50 cm wide in order to lay the parquet on fresh adhesive, before a skin forms.
The boards must be carefully pressed down to flatten any grooves and ensure that the adhesive is transferred to the back of the parquet. If the boards are uneven, they must be weighted down until the adhesive is completely dry.
Cleaning and commissioning
Tools, hands and spills of fresh product must be cleaned with Fast Clean wipes. The polymerised product can be removed mechanically by scraping or sanding.
The premises can be put into service at least 48 hours after application. Drying time may vary depending on temperature, ambient humidity and the porosity of the substrate.
Technical data and packaging
Resybrid CP 130 has a specific weight of 1.75 g/cm³. The skin formation time is approximately 40 minutes at +23°C and 50% relative humidity. The polymerisation rate is greater than or equal to 3 mm per 24 hours. The surface can be walked on after 24 hours, final setting is achieved after 48 hours and sanding or varnishing can be carried out after 72 hours.
Consumption is between 1,000 and 1,400 g/m². The application temperature is between +15°C and +40°C and the service temperature between -20°C and +80°C. The shelf life is approximately 18 months in the original unopened packaging, protected from moisture.
Safety and environment
Resybrid CP 130 is a product for professional use only. Its solvent- and isocyanate-free formulation and very low VOC emissions have been validated by EUROFINS tests, with emissions below 500 μg/m³ after 10 days.
The product must be stored in a well-ventilated area at a maximum temperature of +30 °C. It is recommended that you consult the safety data sheet before use.
Please note that the product photos on the website are not to scale.
